| 摘要 |
<P>PROBLEM TO BE SOLVED: To enhance an adsorption rate by stabilizing the behaviors of electronic parts when a cover tape is exfoliated. <P>SOLUTION: A groove 20A is formed on the lower surface of a suppressor 20 of a part supply unit 3 so as to be located between a slit 23 and a take-out opening 22 which is formed in the suppressor 20 to adsorb and take out an electronic part D. When a carrier tape Cb is fed by one pitch with a tape feeding mechanism of the part supply unit 3 and a cover tape Cc is exfoliated from a carrier tape Ca in front of a part take-out position PU by a cover tape exfoliating mechanism, the contact area between the electronic part D and the lower surface of the suppressor 20 decreases, and the distance between the electronic part D and the lower surface of the suppressor 20 increases. Accordingly, even when the electronic part D is electrostatically charged, the electronic part D can be prevented from adhering to the back surface of the suppressor 20. <P>COPYRIGHT: (C)2012,JPO&INPIT |
