| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting method of electronic components in which poor mounting can be minimized as much as possible. <P>SOLUTION: In a pressure holding step, four hooks 52F, 52G, 52O and 52P of a coil component 1 are pushed into respective through holes by pressing the ribs 53A and 53B of a bobbin 50 of the coil component 1 in the direction of Z-axis by using a pressing jig (not shown). Claws 52H, 52I, 52Q and 52R of the hooks 52F, 52G, 52O and 52P are then projected to the rear face of a mounting substrate by further pressing. Subsequently, the pressing jig is moved in the direction of Z-axis and separated from the bobbin 50. Consequently, the claws 52H, 52I, 52Q and 52R are caught in the rear face of the mounting substrate and latched reliably. <P>COPYRIGHT: (C)2012,JPO&INPIT |
