| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technology capable of measuring temperature characteristics of a semiconductor device under a more accurate preset temperature. <P>SOLUTION: A device 1 for measuring temperature characteristics is a device which measures the temperature characteristics of a semiconductor wafer 31. The device 1 for measuring the temperature characteristics includes a container 10 which can hold a heat medium 21 and the semiconductor wafer 31 in a state that at least a part of the semiconductor wafer 31 is immersed in the liquid heat medium 21 having insulation property. Moreover, this device 1 includes a heating device 11 which heats the heat medium 21 held in the container 10. This device 1 also includes a characteristic measuring instrument 12 which measures the temperature characteristics of the semiconductor wafer 31 in a state that the heat medium 21 is boiling. <P>COPYRIGHT: (C)2012,JPO&INPIT |
