MULTI-CHIP WIRING BOARD AND PROCESS FOR PRODUCING SAME, AND WIRING BOARD AND PROCESS FOR PRODUCING SAME

摘要

Disclosed is a multi-chip wiring board which comprises a ceramic substrate, a conductor, a metal deposit film, and a glass layer, the glass layer having a protrudent part that projects upward from the metal deposit film. The ceramic substrate has a plurality of wiring board regions and partition grooves disposed at the boundaries between the plurality of wiring board regions. The conductor has been disposed in the periphery of each of the plurality of wiring board regions. The metal deposit film has been disposed on the conductor. The glass layer covers the area ranging from the inner surface of each partition groove of the ceramic substrate to the metal deposit film.