LAMINATE FOR CIRCUIT BOARDS AND METAL-BASED CIRCUIT BOARDS

摘要

Provided is an advantageous technique for producing metal-based circuit boards which exhibit excellent thermal dissipation, insulation properties, and peel strength. Disclosed is a laminate (1) for circuit boards which comprises a metal substrate (2), an insulation layer (3) disposed on the metal substrate (2), and a metal foil (4) disposed on the insulation layer (3). The insulation layer (3) comprises both a liquid-crystal polyester and at least 50vol% of an inorganic filler. The inorganic filler consists of boron nitride, and aluminum nitride and/or aluminum oxide, said boron nitride accounting for 35 to 80vol% of the inorganic filler.