| 摘要 |
Disclosed herein are a wafer defect analysis apparatus, an ion extraction device used therein and a wafer defect analysis method using the same, which separate a decoration process and an ion extraction process from each other during decoration of defective regions of a wafer and circulate an electrolyte in the ion extraction device, in which ion extraction has been completed, thus minimizing time consumed for the decoration process, thereby greatly reducing an overall time taken to perform decoration and thus shortening a wafer defect analysis time and improving efficiency of defect analysis. The wafer defect analysis apparatus, the ion extraction device used therein and the wafer defect analysis method using the same improve activity of ions during extraction of the ions for the decoration process, thereby considerably shortening an ion extraction time. |
