发明名称 Heat Dissipation Module
摘要 A heat dissipation module includes a cooling base, a heat dissipating component, and at least one heat pipe. The cooling base includes a heating surface and a conducting surface. On the heating surface is disposed at least one joining part to hold and connect the heat pipe. The heat pipe includes a heat absorbing end and a heat dissipating end. The heat absorbing end is disposed on the joining part of the cooling base. A flat surface parallel to the heating surface of the cooling base is formed on the heat absorbing end. The heat dissipating end is attached to the heat dissipating component. The design of the present invention effectively reduces the weight and thickness of the cooling base and provides better heat dissipation.
申请公布号 US2011290450(A1) 申请公布日期 2011.12.01
申请号 US20100790935 申请日期 2010.05.31
申请人 WU CHUN-MING;ASIA VITAL COMPONENTS CO., LTD. 发明人 WU CHUN-MING
分类号 F28D15/04 主分类号 F28D15/04
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