| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a connection structure, in which a solder is less wetted or spread, and an adhesive between a wiring board and a semiconductor chip is sufficiently excluded, for high connection reliability, in case, in order to form metal bonding with a solder between an electrode of the wiring board and a bump of an electrical element such as a semiconductor chip through a thermo-setting adhesive which solidifies quickly and contains organic peroxide as a polymerization initiator, a compression bonder is used for compressing and connection when manufacturing. <P>SOLUTION: At least a part of electrodes of a wiring board and/or bumps of an electrical element is composed of a solder having a melting temperature Ts (°C). The electrodes of the wiring board and the bumps of the electrical element are connected by compressing from an electrical element side using a compression bonder at a bonding temperature T2 (°C) through an acrylic thermo-setting adhesive containing organic peroxide having one-minute half-life period temperature T1 (°C) as a polymerization initiator, for manufacturing a connection structure. Here, the following formulae (1) and (2) are satisfied. <P>COPYRIGHT: (C)2012,JPO&INPIT |
