SEMICONDUCTOR DEVICE, MASK FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND OPTICAL PROXIMITY CORRECTION METHOD

摘要

PROBLEM TO BE SOLVED: To reduce a processing time of high-accuracy OPC (optical proximity correction) targeting the whole layout of a semiconductor device.

SOLUTION: A semiconductor device includes a circuit part 8 including at least one actual pattern and a plurality of dummy pattern groups 2 each including a plurality of dummy patterns 1 spaced at a first distance 7. The dummy pattern groups 2, and the circuit part 8 and the dummy pattern group 2 are respectively spaced at a second distance 3 larger than the first distance.

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