| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method that can apply a uniform load on a logic chip when the logic chip is bonded to a memory chip. <P>SOLUTION: A semiconductor device manufacturing method comprises a first step of mounting, on one surface of a support substrate, a first semiconductor chip comprising one or plural semiconductor chips each of which has a first bump electrode on at least one surface thereof; a second step of laminating a second semiconductor chip having a second bump electrode on one surface thereof on the one surface of the first semiconductor chip and electrically connecting the second bump electrode and the first bump electrode; a third step of forming a sealing member so that the one surface of the support substrate, the first semiconductor chip, and one surface and side surface of the second semiconductor chip are covered by the sealing member and a surface at the opposite side to the one surface of the second semiconductor chip is exposed; and a fourth step of forming a third bump electrode on a surface at the opposite side of the second semiconductor chip after the sealing member is formed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
