发明名称 CARRIER FOR SUBSTRATE TRANSFER AND MANUFACTURING METHOD OF ELECTRONIC CIRCUIT SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To prevent sticking of substrates readily and reliably and to keep cleanness of substrate surfaces by providing support members between the substrate and the neighboring substrate or an inner wall of a carrier. <P>SOLUTION: A carrier 1 for substrate transfer includes support members 6 in global shapes for preventing sticking of substrates, which is disposed between the neighboring substrates out of the plural substrates 3 and between an inner wall surface of the carrier and the substrate 3. These global support members 6 are connected between adjacent grooves 51 onto each of side plates 5 of the carrier which oppose each other, and provided at the center position of the substrate 3 and at its corresponding upper position right over it in the height direction. Thereby, the sticking of the substrates 3 themselves and/or the sticking of the inner wall of the carrier and the substrate 3 can be prevented, even when the substrate 3 bends beyond a pitch of the grooves of the carrier, during a cleaning process and/or a desiccation process. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011243814(A) 申请公布日期 2011.12.01
申请号 JP20100115817 申请日期 2010.05.19
申请人 SHARP CORP 发明人 KOYAMA YASUHIRO;ODA HAJIME;OKAYAMA MORIYA;SAWAI KEIICHI
分类号 H01L21/673;B65G49/04;H01L21/304;H01L21/683 主分类号 H01L21/673
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