| 发明名称 |
SEMICONDUCTOR-SEALING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE USING SAME |
| 摘要 |
The disclosed semiconductor-sealing resin composition contains a compound comprising the following esterified by a C5-25 alcohol in the presence of a compound represented by general formula (1): (A) an epoxy resin; (B) a hardener; (C) an inorganic filler; and (D) a copolymer of a C5-80 1-alkene and maleic anhydride. In general formula (1), R1 is a C1-5 alkyl group, a C1-5 alkyl halide group, or a C6-10 aromatic group. |
| 申请公布号 |
WO2011148628(A1) |
申请公布日期 |
2011.12.01 |
| 申请号 |
WO2011JP02906 |
申请日期 |
2011.05.25 |
| 申请人 |
SUMITOMO BAKELITE CO., LTD.;TABEI, JUN-ICHI |
发明人 |
TABEI, JUN-ICHI |
| 分类号 |
C08L63/00;C08F8/14;C08F210/14;C08K3/00;C08L23/26;H01L23/29;H01L23/31;H01L25/065;H01L25/07;H01L25/18 |
主分类号 |
C08L63/00 |
| 代理机构 |
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