| 摘要 |
The invention relates to a method for creating a multi-component device, including the following steps, creating a module (1) having a multilayer structure comprising electrical/electronic components (C10, C20) arranged on at least one substrate in stacked layers, the components each having a main surface (F1, F2) exposed to the outside, characterized in that the components are arranged such that the respective main surfaces (F1, F2) thereof are oriented in mutually opposite directions. The invention also relates to the corresponding device. |
