发明名称 |
PERFORMANCE IMPROVEMENT FOR A MULTI-CHIP SYSTEM VIA KERF AREA INTERCONNECT |
摘要 |
A semiconductor wafer comprises a first chip and a second chip, each chip comprising a core, link layer and physical layer. A kerf area physically connects the two chips on the wafer, and a kerf area interconnect selectively couples the link layers of the two chips while the two physical layers are disabled. |
申请公布号 |
US2011295543(A1) |
申请公布日期 |
2011.12.01 |
申请号 |
US20100789669 |
申请日期 |
2010.05.28 |
申请人 |
FOX BENJAMIN A.;GIBBS NATHANIEL J.;MAKI ANDREW B.;TIMPANE TREVOR J.;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
FOX BENJAMIN A.;GIBBS NATHANIEL J.;MAKI ANDREW B.;TIMPANE TREVOR J. |
分类号 |
G01R31/28;G06F19/00;H01L23/538 |
主分类号 |
G01R31/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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