发明名称 SUPERCRITICAL DRYING METHOD
摘要 According to one embodiment, a semiconductor substrate having a surface wetted with a chemical solution is introduced into a chamber, and a supercritical fluid is supplied into the chamber. The temperature in the chamber is adjusted to the critical temperature of the chemical solution or higher, so that the chemical solution is put into a supercritical state. The pressure in the chamber is then lowered, and the chemical solution in the critical state is turned into gaseous matter. The gaseous matter is then discharged from the chamber.
申请公布号 US2011289793(A1) 申请公布日期 2011.12.01
申请号 US20100976593 申请日期 2010.12.22
申请人 HAYASHI HIDEKAZU;TOMITA HIROSHI;OKUCHI HISASHI;SATO YOHEI;KITAJIMA YUKIKO 发明人 HAYASHI HIDEKAZU;TOMITA HIROSHI;OKUCHI HISASHI;SATO YOHEI;KITAJIMA YUKIKO
分类号 F26B3/02;B08B3/10 主分类号 F26B3/02
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