摘要 |
Provided are a light emitting device, a method for fabricating the light emitting device, a light emitting device package, and a lighting unit. The light emitting device includes a support member having a stepped portion on a side surface, a light emitting structure on the support member, the light emitting structure including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer to generate light, and an electrode supplying a power to the first conductive type semiconductor layer. The support member has a first surface on which the light emitting structure is disposed and a second surface having an area greater than that of the first surface. |