| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a carrier for a double-side polishing apparatus, a double-side polishing apparatus and a double-side polishing method which suppress deterioration in the shape of a chamfered portion of a wafer, and the occurrence of scratches in the plane of the wafer and the chamfered portion while preventing the breakage of a peripheral edge of the wafer. <P>SOLUTION: The carrier for the double-side polishing apparatus for polishing double sides of a wafer having a chamfered portion at its peripheral edge includes at least a carrier base body which is disposed between upper and lower surface plates having polishing cloths attached thereto, respectively, and has a holding hole for holding the wafer sandwiched between the upper and lower surface plates during the polishing of the wafer, and a ring-shaped resin ring which is disposed along the inner circumference of the holding hole in the carrier base body, and brought into contact with the chamfered portion of the wafer to be held to protect the chamfered portion. The tensile modulus of the resin ring based on the tensile test in compliance with ASTM D638 is ≥12 GPa and ≤20 GPa, and the resin ring is formed of the resin not containing any inorganic reinforcing material. <P>COPYRIGHT: (C)2012,JPO&INPIT |
