CONNECTING STRUCTURE AND ADHESION METHOD OF PCB USING ANISOTROPIC CONDUCTIVE FILM, AND METHOD FOR EVALUATING CONNECTING CONDITION USING THE SAME

摘要

A connecting structure of PCB using an anisotropic conductive film according to the present invention having members connected to each other by heat-compression using the anisotropic conductive film including an insulating adhesive as a base material and conductive particles dispersed in the insulating adhesive, wherein at least any one of the members has a flexible property, and a surface roughness value (Ra) of the member having a flexible property is 0.1 to 5.0 μm due to dents formed by heat-compression.