| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermoelectric system that can achieve cost reduction and an improved performance, as well as having capability to address detrimental effects of differential thermal expansion. <P>SOLUTION: A first heat transfer structure of the thermoelectric system comprises a first portion and a second portion, the second portion being configured to be in thermal communication with a first working medium. A second heat transfer structure comprises a first portion and a second portion, the second portion being configured to be in thermal communication with a second working medium. A third heat transfer structure has a first portion and a second portion, the second portion being configured to be in thermal communication with the first working medium. A first plurality of thermoelectric (TE) elements are sandwiched between the first portion of the first heat transfer structure and the first portion of the second heat transfer structure. A second plurality of TE elements are sandwiched between the first portion of the second heat transfer structure and the first portion of the third heat transfer structure, so as to form a stack of TE elements and heat transfer structures. The second portion of the first heat transfer structure and the second portion of the third heat transfer structure project away from the stack in a first direction, and the second portion of the second heat transfer structure project away from the stack in a second direction generally opposite to the first direction. <P>COPYRIGHT: (C)2012,JPO&INPIT |
