| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor package which is thin and has high quality. <P>SOLUTION: The method comprises: a step for mounting first semiconductor chips 11A,11B on a wiring layer 12 formed on a silicon substrate 8; a step for filling peripheries of the first semiconductor chips 11A,11B with insulating resins 13,14; a step for setting the insulating resins 13,14 and the first semiconductor chips 11A,11B at a side opposing to the silicon substrate 8 side to the same level by thinly-polishing the insulating the resins 13,14 and/or the first semiconductor chips 11A,11B from the side opposing to the silicon substrate 8 side ; a step for forming re-wiring layer 22 on the side opposing to the silicon substrate 8 side in the first semiconductor chips 11A,11B and mounting second semiconductor chips 21A,21B on the re-wiring layer 22; and step for filling peripheries of the semiconductor chips 21A,21B with insulating resins 23,24. <P>COPYRIGHT: (C)2012,JPO&INPIT |
