发明名称 |
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE |
摘要 |
A method of manufacturing a semiconductor device is disclosed. One embodiment provides a carrier. Semiconductor chips are placed over the carrier. The semiconductor chips include contact elements. A polymer material is applied over the semiconductor chips and the carrier. The polymer material is removed until the contact elements are exposed. The carrier is removed from the semiconductor chips.
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申请公布号 |
US2011291274(A1) |
申请公布日期 |
2011.12.01 |
申请号 |
US201113205356 |
申请日期 |
2011.08.08 |
申请人 |
MEYER THORSTEN;OFNER GERALD;STEINER RAINER;INFINEON TECHNOLOGIES AG |
发明人 |
MEYER THORSTEN;OFNER GERALD;STEINER RAINER |
分类号 |
H01L23/488;H01L23/48 |
主分类号 |
H01L23/488 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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