发明名称 |
DEFECT INSPECTING METHOD, DEFECT INSPECTING APPARATUS, AND RECORDING MEDIUM |
摘要 |
According to one embodiment, a defect inspecting method includes: separately detecting an amount of first secondary electrons emitted from a semiconductor substrate at a first elevation angle and an amount of second secondary electrons emitted at a second elevation angle different from the first elevation angle; creating potential contrast images respectively from the detected amounts of the first and second secondary electrons; determining a combination ratio of the created respective potential contrast images; combining the potential contrast images respectively created from the first and second secondary electrons at the determined combination ratio; and extracting a defect based on the combined potential contrast image. The determining a combination ratio includes: calculating the luminance of the bottom between the wires; determining whether the calculated luminance exceeds a predetermined reference value; and changing the combination ratio when the calculated luminance does not exceed the predetermined reference value.
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申请公布号 |
US2011293167(A1) |
申请公布日期 |
2011.12.01 |
申请号 |
US201113052160 |
申请日期 |
2011.03.21 |
申请人 |
HAYASHI HIROYUKI;KABUSHIKI KAISHA TOSHIBA |
发明人 |
HAYASHI HIROYUKI |
分类号 |
G06K9/00 |
主分类号 |
G06K9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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