Component carrier i.e. metal core printed circuit board, for LED lighting device, has heat guide element arranged on mounting plate and in contact with electronic component, where heat guide element passes through heat sink

摘要

The carrier (25) has a dielectric layer (13) arranged on a heat sink, where thickness of the heat sink is 0.5-2 mm and thickness of the dielectric layer is about 25 micro meter. A conductive path structure (12) is arranged on the dielectric layer to provide a surface mount device (SMD) mounting plate for an electronic component i.e. LED (1). A heat guide element (24) is arranged on the mounting plate and in contact with the electronic component, and passes through the heat sink. The heat guide element integrally implements projection with the heat sink. Independent claims are also included for the following: (1) a lighting device having a thermal contact area directly in contact with a heat guide element (2) a method for manufacturing a component carrier (3) a method for loading a component carrier.