| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component module capable of improving reliability of a sealing resin layer at a low manufacturing cost in which a part of a conductive post is exposed from the sealing resin layer. <P>SOLUTION: A method of manufacturing an electronic component module 1 includes: mounting electronic components 12 and 13 on one surface of a circuit board 11; forming at least one conductive post 14 on one surface of the circuit board 11 and/or the electronic components 12 and 13 mounted on one surface of the circuit board 11; and forming a semi-cured sealing resin layer 15 that covers the electronic components 12, 13 and the conductive post 14 on one surface of the circuit board 11. The method further includes: placing an elastic member 16 on the top surface of the sealing resin layer 15; embedding a part of the conductive post 14 in the elastic member 16 by pressing the sealing resin layer 15 through the elastic member 16; and peeling off the elastic member 16 from the sealing resin layer 15 and curing the sealing resin layer 15 by heating. <P>COPYRIGHT: (C)2012,JPO&INPIT |
