| 发明名称 |
WAFER PROCESSING METHOD, WAFER POLISHING APPARATUS, AND INGOT SLICING APPARATUS |
| 摘要 |
In a wafer processing method, an ingot is sliced into a wafer and the wafer is planarized by polishing a surface of the wafer. When the wafer is planarized, the wafer is disposed on a wafer holder and the wafer is rotated, a heat quantity is applied to a portion of the wafer so as to form a reformed layer at the portion of the wafer, and a polishing tool is brought into contact with the portion of wafer while rotating so as to polish the portion of the wafer. |
| 申请公布号 |
US2011294403(A1) |
申请公布日期 |
2011.12.01 |
| 申请号 |
US201113114141 |
申请日期 |
2011.05.24 |
| 申请人 |
KOUTAKE KYOHEI;MORITA HIROMICHI;KANO FUMIYOSHI;YAMAGUCHI TETSUJI;INOMATA SUMITOMO;NAGAYA MASATAKE;DENSO CORPORATION |
发明人 |
KOUTAKE KYOHEI;MORITA HIROMICHI;KANO FUMIYOSHI;YAMAGUCHI TETSUJI;INOMATA SUMITOMO;NAGAYA MASATAKE |
| 分类号 |
B24B1/00;B24B49/16;B28D1/02 |
主分类号 |
B24B1/00 |
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