| 摘要 |
The present invention relates to a structure for a spring contact, comprising: an upper contact pin including a cylindrical contact portion and a head portion configured with a plurality of contact projections on the circumferential end thereof so as to contact a lead of a separate semiconductor IC to be tested, and also including a neck portion, two spring-fixing projections, and a body; a lower contact pin perpendicularly coupled to the upper contact pin; and a spring inserted between the upper contact spring and the lower contact spring. The body includes: an inclined surface and catch projection formed on an end thereof; two symmetrical resilient portions, each having an escape slot defined therein; and a movement slot for housing, retaining, and allowing the movement of a catch projection of the lower contact pin, and for electrically contacting the catch projection of the lower contact pin. In particular, a spring contact structure and various soldering-type spring contact structures can be provided, in which the head portion of the contact is formed in a cylindrical shape in order to provide reinforcement to reduce the likelihood of pin breakage, and four or five crowns are formed as contact projections on circular perimeters of the contact portions so as to maximize contact yield with an IC lead. |
