3D SEMICONDUCTOR DEVICE

摘要

PURPOSE: A 3D semiconductor device is provided to enable a maser chip to have a channel load by connecting only the electrode pad of the master chip to a channel. CONSTITUTION: In a 3D semiconductor device, chips(110,120,130,140) are laminated on a substrate(150). Chips are connected to each other through a penetrating electrode(160). Chips are composed of first sides(112,122,132,142) and second sides(114,124,134,144). A first chip is operated as the master chip. The second to fourth chips are operated as a slave chip.