发明名称 TOOL FOR SOLDERING
摘要 PURPOSE: A jig for soldering is provided to minimize the tolerance of a hall element and solder ball with the non-circular shape hall element, thereby precisely mounting the solder ball on a ball land. CONSTITUTION: A jig(T) for soldering includes a panel(10) including a hole aggregate(11) comprised of non-circular shape hall elements. The hall element is arranged according to the shape and position of a solder ball land for each chip. The panel is comprised of a frame for fixing a main body with a panel main body which is a thin plate. A symmetry axis of the hall element is slanted with respect to a solder ball moving axis. The hall element has a square shape. The symmetry axis of the hall element is slanted to 5 to 35 degrees with respect to the solder ball moving axis.
申请公布号 KR20110129296(A) 申请公布日期 2011.12.01
申请号 KR20100048852 申请日期 2010.05.25
申请人 REGEN-I CO., LTD. 发明人 LEEM, CHAE YOUL
分类号 H01L21/60 主分类号 H01L21/60
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