| 发明名称 |
RELEASE FILM AND METHOD FOR MANUFACTURING LED PACKAGE USING THE SAME |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a release film which cannot be torn easily and which has excellent releasability from a mold and from a molded article, and has excellent followability to the mold having a complicated shape. <P>SOLUTION: The release film includes: a base material layer including block copolymer having a polyester unit and a polyether unit; and a surface layer including 4-methyl-1-pentene polymer to be arranged at least on one surface of the base material layer. A storage modulus E' of the release film at 120°C is 1.00×10<SP POS="POST">7</SP>to 8.00×10<SP POS="POST">7</SP>Pa. <P>COPYRIGHT: (C)2012,JPO&INPIT |
| 申请公布号 |
JP2011240547(A) |
申请公布日期 |
2011.12.01 |
| 申请号 |
JP20100113238 |
申请日期 |
2010.05.17 |
| 申请人 |
MITSUI CHEMICALS INC |
发明人 |
OKUMURA MAHO;SANADA TAKAYUKI |
| 分类号 |
B32B27/00;B32B27/36;H01L33/00 |
主分类号 |
B32B27/00 |
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