发明名称 WIRELESS IC DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a wireless IC device which does not cause peeling between an element assembly and a radiator and does not easily change its communication characteristic, even when it is attached to a curved surface. <P>SOLUTION: The wireless IC device comprises: a dielectric element body 20 forming a rectangular parallelepiped shape; a metal pattern 30 which is provided on a surface of the dielectric element body 20 and functions as the radiator; and a wireless IC element 50 combined with electric supply parts 35a, 35b in the metal pattern 30. The dielectric element body 20 has flexibility by being provided with a plurality of slits 21 on its surface. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011244109(A) 申请公布日期 2011.12.01
申请号 JP20100112675 申请日期 2010.05.14
申请人 MURATA MFG CO LTD 发明人 DOKAI TAKEYA;KAISHITA NIHEI;NONOGAKI YUTAKA;GOTO RYOHEI;YAMAGUCHI TAKAHIRO;IKEDA KAZUYUKI
分类号 H01Q1/38;G06K19/077;H01Q23/00 主分类号 H01Q1/38
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