发明名称 |
COOLING MODULE ASSEMBLY METHOD |
摘要 |
PURPOSE: A method for manufacturing a cooling module assembly is provided to improve cooling efficiency by uniting the contact surface of a heat dissipation unit to a circuit board and to reduce manufacturing costs of the cooling module assembly. CONSTITUTION: A first side(12) and a second side(13) are included in both sides of a circuit board(1). The first side is combined with the contact surface of a heat dissipation unit. The heat dissipation unit is manufactured using a metal material. The heat dissipation unit comprises a plurality of pins. A penetration hole(11) is formed by extending the second side from the first side of the circuit board. A plurality of screw holes is formed in the heat dissipation unit in order to unite the heat dissipation unit and the circuit board. |
申请公布号 |
KR20110129320(A) |
申请公布日期 |
2011.12.01 |
申请号 |
KR20100067336 |
申请日期 |
2010.07.13 |
申请人 |
SUNONWEALTH ELECTRIC MACHINE INDUSTRY CO., LTD. |
发明人 |
HORNG ALEX;KUO CHI HUNG;CHUNG CHIH HAO;CHENG CHUNG KEN;WANG JUL FENG |
分类号 |
F21V29/00;F21V17/00;H05K7/20 |
主分类号 |
F21V29/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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