| 摘要 |
PURPOSE: A semiconductor chip and a stack package including the same are provided to omit an additional space for arranging wire redistribution for chip selection in each stacked semiconductor chip, thereby reducing the total size and height of the stack package. CONSTITUTION: A semiconductor substrate(310) comprises one surface and another side facing the one surface. An active layer(320) comprises a chip selection pad and a signal pad arranged on the upper surface of the active layer. A first penetration electrode(332) is electrically connected to the signal pads. A second penetration electrode(334) is connected to the chip selection pads. A lateral electrode(340) is arranged in one surface of the semiconductor substrate with a depth of 10 to 25μm. |
