| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve easy soldering connection by lead-free solder having a melting point of 260°C or higher. <P>SOLUTION: An internal connection member 70 is disposed to connect lead-free solder films 72a, 72b formed on a metal piece 71 to an electrode pad 21 of a semiconductor chip 10. By fusing the solder films 72a, 72b by heating, the internal connection member 70 and the semiconductor chip 10 are connected by soldering. Each melting point of the solder films 72a, 72b is 260°C or higher. <P>COPYRIGHT: (C)2012,JPO&INPIT |
