发明名称 OPENING GROOVE PROCESSING METHOD FOR STRAW PACKAGE, AND STRAW PACKAGE
摘要 <P>PROBLEM TO BE SOLVED: To provide a technology for forming an opening groove of a straw package in high accuracy. <P>SOLUTION: There is provided a processing method for an opening groove composed of a half-cut line in a straw package 10 having a straw 16 enclosed between a front surface film 14 and a back surface film 12, wherein a shielding member 52 is arranged on the surface of the back surface film 12, a laser beam L1 is radiated against a first shielding plate 52a and after this operation, a radiating position of the laser beam L1 is moved by a desired amount in a direction crossing the straw 16, thereby a first half-cut line 30 is formed near an upper end 16a of the straw 16 at the back surface film 12. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011240994(A) 申请公布日期 2011.12.01
申请号 JP20110093202 申请日期 2011.04.19
申请人 TECHNO PLUS:KK;YAKULT HONSHA CO LTD;TOHO SHOJI KK 发明人 KIMURA MASAKI
分类号 B65B61/00;B23K26/00;B23K26/06;B23K26/38;B65D77/30 主分类号 B65B61/00
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