SEMICONDUCTOR DEVICE PACKAGE FEATURING ENCAPSULATED LEADFRAME WITH PROJECTING BUMPS OR BALLS

摘要

Embodiments of the present invention relate to semiconductor device packages featuring encapsulated leadframes in electrical communication with at least one die through electrically conducting bumps or balls and electrically conducting ribbons. Embodiments of the present invention may permit multiple die and/or multiple passive devices to occupy space in the package previously consumed by the diepad. The result is a flexible packaging process allowing the combination of die and technologies required for complete sub-systems in a conventional small JEDEC specified footprint.