PROCESS FOR CREATING AN INSPECTION PROGRAM

摘要

The present invention relates to a process for creating an inspection program for an inspection substrate without gerber files. In order to create an inspection program, first image information is obtained by scanning a bare board, then second image information is obtained by scanning a solder leveled board coated with a solder on the pad region of the bare board, and the first image information and the second image information are finally analyzed to create an inspection program. The first image information and the second image information can include at least one of 2D image information and 3D image information. An inspection program creating process comprises: calculating a difference between the first image information and the second image information; extracting the location and size for a region having the difference; and creating an inspection program using the extracted information. As such, the bare board and the solder leveled board are inspected separately and then a difference in the 2D image information or the 3D image information obtained through the inspection is analyzed to extract an accurate location and size for the solder leveled region.