| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve detection sensitivity of an acceleration sensor and an angular velocity sensor by sealing the sensors in respectively corresponding pressure atmospheres in a series of joining processes. <P>SOLUTION: A movable body 111 of an acceleration sensor 11 and a vibrator 121 of an angular velocity sensor 12 are fabricated as separated by a wall 16 from each other on the same sensor wafer 10. A cap wafer 20 having gaps 21 and 22 corresponding to the movable body 111 and the vibrator 121 of the acceleration sensor 11 and the angular velocity sensor 12, respectively, is formed, and a bump 23 is disposed near the gap 22 for the angular velocity sensor 12. After sealing the acceleration sensor 11 under the atmospheric pressure, the angular velocity sensor 12 is subjected to vacuum sealing while applying a high temperature and a high load thereto. Then the sensor wafer is subjected to processes of cutting with a diamond grindstone and mounting of a circuit board or a wiring board, to form a composite sensor. <P>COPYRIGHT: (C)2012,JPO&INPIT |
