发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device capable of providing a stable electric property and high reliability to the semiconductor device using an oxide semiconductor. <P>SOLUTION: In steps for manufacturing a bottom-gate structure transistor having an oxide semiconductor film, dehydration or dehydrogenation treatment by heat treatment, and oxygen doping treatment are performed. The transistor having an oxide semiconductor film treated by dehydration or dehydrogenation treatment by heat treatment, and treated by oxygen doping treatment in steps for manufacturing the same, can reduce the amount of change of a threshold voltage of the transistor even before and after a bias-thermal stress test(BT test), and have high reliability. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011243971(A) 申请公布日期 2011.12.01
申请号 JP20110094895 申请日期 2011.04.21
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 YAMAZAKI SHUNPEI
分类号 H01L29/786;G02F1/1368;G09F9/00;G09F9/30;H01L21/336;H01L51/50 主分类号 H01L29/786
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