发明名称 LASER BEAM MACHINING DEVICE AND ABNORMALITY MONITORING METHOD OF THE LASER BEAM MACHINING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To easily and rapidly specify a cause of output abnormality of a laser beam. <P>SOLUTION: In a step S2, monitoring of a temperature near at least one of a position into which the laser beam is incident, a position through which the laser beam passes, a position from which the laser beam is emitted, and a position to which another component on the light path is connected is started, which are the prescribed positions of a plurality of components on the light path of the laser beam of the laser beam machining device. In a step S4, monitoring of output of the laser beam is started. When abnormality of output of the laser beam is detected in a step S6, control is performed so that a temperature in measurement portions are recorded in a recording part in a step S10. This invention is applicable to the laser beam machining device performing various machining. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011240361(A) 申请公布日期 2011.12.01
申请号 JP20100113929 申请日期 2010.05.18
申请人 OMRON CORP 发明人 HAGIWARA KENICHIRO
分类号 B23K26/00;B23K26/08 主分类号 B23K26/00
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