| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device and a method for manufacturing the same capable of making a whole device thin and to provide a substrate for the semiconductor device and the method for manufacturing the same. <P>SOLUTION: The semiconductor device 10 includes: a plurality of terminal parts 13 having respective protruding portions 13c; a die pad 12 having protruding portions 12c; and a semiconductor element 15 electrically connected to inner terminal surfaces 13b of each of the terminal parts 13 through connection parts 17. Sealing resin parts 11 seal the die pad 12, the terminal parts 13, the semiconductor element 15 and the connection parts 17. Also, external terminal surfaces 13a of each of the terminal parts 13 and an outer surface 12a of the die pad 12 are arranged on the same plane. In addition, permanent resist layers 18 are formed between a lower section of the protruding portions 12c of the die pad and a lower section of the protruding portions 13c of the terminal parts 13 as well as between the lower sections of the protruding portions 13c of the adjacent terminal parts 13. <P>COPYRIGHT: (C)2012,JPO&INPIT |
