| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an implementation head for automated component implementation on a substrate with a simplified modular structure that can be fabricated at a low cost, while providing users with ease in attachment and detachment of various implementation head modules to and from the implementation head, and related apparatus and method that attain the same. <P>SOLUTION: An implementation head comprises a frame element 1 for the attachment of a plurality of implementation head modules 10, 11, and 12. The frame element comprises two or more interfaces 2, each of which is configured to transfer, to each implementation head module, respective one of the following: energy and both or either one of data and air. At least two interfaces of the frame element are formed to have the same shape. <P>COPYRIGHT: (C)2012,JPO&INPIT |
