发明名称 MOLD FOR INJECTION MOLDING AND MOLDED PRODUCT THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide a molded product having a low distortion region and a hole without a weld line. <P>SOLUTION: When the shape of the molded product includes a hole shape, a resin collides against a mold shape for forming the hole and a resin flow passage diverges. When divergence ends and the resins converge again, the resin surfaces are solidified and not joined together completely, and a weld line occurs in the molded product. A high temperature cooling circuit 2 is disposed in a region close to a molded product contact face 4, and steam at a temperature not lower than a glass transition point of the resin is made to flow through the high temperature cooling circuit 2 before injection of the resin. The steam is stopped just after the injection of the resin, and loading of the resin is finished while nothing is made to flow through the high temperature cooling circuit 2. The resin is solidified by the temperature of a low temperature cooling circuit 1, and the molded product is taken out by opening the mold after solidification is completed. Since the surface temperature of a mold nest 3 in a weld line deleting region 6 is increased when the resin flows, solidification of the resin surfaces converging again after the divergence of the flow passage is delayed, joining of the resin can be carried out completely and the weld line can be deleted. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011240613(A) 申请公布日期 2011.12.01
申请号 JP20100115018 申请日期 2010.05.19
申请人 PANASONIC CORP 发明人 OKAMOTO SHOICHI;KAWANISHI NOBUHISA;ISERI MITSUHIRO;FUJITA MASARU
分类号 B29C45/73;B29C45/70 主分类号 B29C45/73
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