| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing gel from creeping up on a lid. <P>SOLUTION: A mother case 12 is provided on a base plate 10. A projection 14 is provided in the inner wall of the mother case 12. A semiconductor element 18 is provided on the base plate 10 in the mother case 12. A pin terminal 20 and a screw block terminal 22 are retained by the projection 14. The pin terminal 20 and the screw block terminal 22 are connected to the semiconductor element 18. Silicone gel 26 is filled in the mother case 12. A lid 28 is attached to the mother case 12. The lid 28 seals the semiconductor element 18 and the silicone gel 26. The lower end of a pillar 30 contacts the base plate 10, and the upper end of the pillar 30 contacts the lower surface of the lid 28. The pillar 30 fixes the lid 28 to the mother case 12. The top surface of the projection 14 and the lower surface of the lid are separated. <P>COPYRIGHT: (C)2012,JPO&INPIT |
