| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a supporting device and a supporting method of a plate-like member which can hold the plate-like member appropriately even if a protrusion and a recess are formed in the surface on one side of the plate-like member. <P>SOLUTION: Holding means 3 is constituted to have an annular frame 5 along the outer edge of a wafer W. The wafer W can be sucked and held by sucking air from a suction port 7 facing the surface of a protrusion WB without making suction force act on a recess WC of the wafer W. Consequently, the wafer can be held appropriately while reducing a stress acting on the wafer W. <P>COPYRIGHT: (C)2012,JPO&INPIT |
