发明名称 LIGHT EMITTING DIODE STRUCTURE WITH TRANSPARENT CONDUCTIVE HEAT DISSIPATION FILM
摘要 <p>A light emitting diode structure with transparent conductive heat-dissipating film comprises a sapphire substrate (10), an epitaxial light emitting structure (20), a transparent conductive heat-dissipating film (35), a first metal contact layer (41) and a second metal contact layer (43). The transparent conductive heat-dissipating film (35) has a crystal surface structure, and transfers the generated heat from an upper surface to a lower surface by heat radiating. It is possible to improve the heat-dissipating capability, increase the light emitting efficiency and prolong the life period of the light emitting diode.</p>
申请公布号 WO2011147289(A1) 申请公布日期 2011.12.01
申请号 WO2011CN74476 申请日期 2011.05.21
申请人 FANG, FANG;CHEN, JEONG-SHIUN 发明人 CHEN, JEONG-SHIUN
分类号 H01L33/36;H01L33/42 主分类号 H01L33/36
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