SEMICONDUCTOR INTEGRATED CIRCUIT HAVING A MULTI-CHIP STRUCTURE

摘要

A semiconductor integrated circuit having a multi-chip structure includes a number of stacked semiconductor chips. Each of the semiconductor chips includes a first through electrode formed through the semiconductor chip, a first bump pad formed over the semiconductor chip at a region where the first bump pad is separated from the first through electrode, a first internal circuit formed inside the semiconductor chip, coupled to the first through electrode through a first metal path, and coupled to the first bump pad through a second metal path; and a redistribution layer (RDL) formed over a backside of the semiconductor chip.