| 摘要 |
PURPOSE: A flip chip package and a method of fabricating the same are provided to increase production yield by reducing a process time and processing unit costs. CONSTITUTION: A flip chip package(100) comprises a semiconductor chip(110), a substrate(101), a connection element(112), and a filling element(114). The semiconductor chip comprises the bonding pad(108). The substrate comprises a chip mounting range(103) and a peripheral area(105). The chip mounting range comprises an electrode terminals opposite to the bonding pad. The peripheral area has the penetration part(106). The peripheral area is arranged around the chip mounting range. The connection element electrically connects the bonding pad and electrode terminal. The filling element fills the space between the semiconductor chip, the substrate, and a penetration part. |
