| 摘要 |
<p>The present invention relates to a method for dividing a substrate into a number of individual chip parts, comprising the steps of:
forming a number of chip parts in the substrate, comprising, for each chip part, of arranging recesses in the substrate for containing fluid;
arranging one or more breaking grooves in the substrate along individual chip parts;
applying mechanical force to the substrate to break the substrate along the breaking grooves;
wherein the steps of arranging recesses in the substrate and arranging breaking grooves in the substrate are performed substantially simultaneously,
wherein the substrate comprises a first and a second substrate part, and the method comprises the steps of:
a) arranging in the first substrate part at least one recess for containing fluid;
b) arranging in the second substrate part passages to the recess in the first substrate part, wherein a first passage forms a fluid feed and a second passage forms a fluid discharge;
c) arranging one or more breaking grooves in at least one of the substrate parts;
d) placing the second substrate part on the first substrate part;
e) breaking the substrate along the breaking grooves.</p> |
