| 摘要 |
<p>The present invention relates to a method of placing solder balls 400 on a substrate, the method comprising: providing a substrate; providing a plurality of balls comprising solder; providing a ball placement stencil 100 having an upper side and a lower side, the ball placement stencil comprising a plurality of apertures for receiving the balls and positioning the balls on the substrate, and having attached thereto a plurality of discrete spacing means on the lower side; positioning the ball placement stencil adjacent the substrate so that the ball placement stencil is spaced from the substrate by the spacing means; and depositing the balls onto the substrate via the apertures of the stencil, wherein the apertures reduce in width from the upper side towards the lower side.</p> |
