| 摘要 |
AN OBJECT IS TO PROVIDE A DOUBLE-SIDED COPPER CLAD LAMINATE FOR FORMING A CAPACITOR LAYER THAT DOES NOT DEVELOP SHORT-CIRCUIT EVEN WHEN A VOLTAGE IS APPLIED BETWEEN COPPER FOILS, EXHIBITS A SUPERIOR WITHSTAND VOLTAGE, AND HAS AN INSULATING LAYER WHICH IS NOT FRACTURED BY A SHOWERING PRESSURE DURING ETCHING. TO ATTAIN THE OBJECT, THERE IS USED A DOUBLE-SIDED COPPER CLAD LAMINATE FOR FORMING A CAPACITOR LAYER HAVING A LAYERED STRUCTURE COMPRISING CONDUCTIVE COPPER FOIL LAYERS ARRANGED AT OUTER LAYERS ON BOTH SIDES THEREOF AND A RESIN LAYER, WHICH IS DIELECTRIC, SANDWICHED BETWEEN THE COPPER FOILS ON THE ONE SIDE AND THE OTHER SIDE, THE DOUBLE-SIDED COPPER CLAD LAMINATE FOR FORMING A CAPACITOR LAYER BEING CHARACTERIZED IN THAT THE RESIN LAYER HAS A THREE-LAYER STRUCTURE COMPRISING A THERMOSETTING RESIN LAYER, A HEAT RESISTANT FILM LAYER AND A THERMOSETTING RESIN LAYER IN THIS ORDER AND HAS A TOTAL THICKNESS OF 25 μM OR LESS, THE THERMOSETTING RESIN LAYER IS MADE OF EPOXY RESIN MATERIAL, AND THE HEAT RESISTANT FILM LAYER IS MADE OF A RESIN MATERIAL THAT HAS ORDINARY PROPERTIES OF A YOUNG'S MODULUS OF 300KG/MM² OR MORE, A TENSILE STRENGTH OF 20 KG/MM² OR MORE AND AN ELONGATION PERCENTAGE OF 5% OR MORE, A SOFTENING POINT HIGHER THAN A MOLDING TEMPERATURE FOR THE THERMOSETTING RESIN FORMING THE THERMOSETTING RESIN LAYERS ON BOTH SIDES THEREOF, AND A RELATIVE DIELECTRIC CONSTANT OF 2.5 OR MORE. ALSO, A METHOD OF MANUFACTURING SUCH A DOUBLE-SIDED COPPER CLAD LAMINATE IS PROVIDED.
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